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With the support of

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Download the full list of invited talks with the abstracts: ESSDERC/ESSCIRC Plenary Talks

 

ESSDERC/ESSCIRC JOINT PLENARY TALKS

Scott DeBoer, Micron, ID, USA
A Semiconductor Memory Manufacturing and Development Perspective

Thomas H. Lee, Stanford University, CA, USA
Terahertz Electronics: The Last Frontier

Fabio Marchiò, STMicroelectonics, Italy
Automotive Electronics: Application & Technology Megatrends

Walter Snoeys, CERN, Switzerland
How Chips Helped Discover the Higgs Boson at CERN

An Steegen, IMEC , Belgium
Logic Scaling Beyond 10nm, a Power-Performance-Area-Cost Trade-off

Sehat Sutardja, Marvell Semiconductor, CA, USA
Tremendous Benefits of Moore’s Law Have Yet to Come


ESSDERC PLENARY TALKS

Umesh Mishra, UCSB, CA, USA
GaN-based solutions from KHz to THz

Eric Pop, Stanford University, CA, USA
Energy Efficiency and Conversion in 1D and 2D Electronics

Takao Someya, University of Tokyo, Japan
Bionic Skins Using Flexible Organic Devices

ESSCIRC PLENARY TALKS

Hooman Darabi, Broadcom Corporation, CA, USA
Blocker Tolerant Software Defined Receivers

Un-Ku Moon, Oregon State University, OR, USA
Emerging ADCs

Kathleen Philips, IMEC-Holst Centre, The Netherlands
Ultra-Low Power Short Range Radios

ESSDERC Focus session: Flexible electronics

Session organizer: Joachim N. Burghartz, IMS CHIPS, Stuttgart

Luigi G. Occhipinti, University of Cambridge, Cambridge
Innovative Manufacturing of large-area electronics

Jukka Hast, VTT Technical Research Centre of Finland, Oulu
Freeform and flexible electronics manufacturing using R2R printing and hybrid integration techniques

Isabelle Chartier, CEA LITEN, Grenoble
Printed OTFT complementary circuits and matrix for Smart Sensing Surfaces applications

Jeroen van den Brand, Holst Centre/TNO, Eindhoven
Flexible and stretchable electronics for wearable healthcare

Christine Harendt, IMS CHIPS, Stuttgart
Hybrid Systems in Foil (HySiF) Exploiting Ultra-thin Flexible Chips

 

ESSDERC Focus session: Special session on Manufacturing of Advanced Semiconductor Devices

Session organizer: Lothar Pfitzner, Fraunhofer IISB, Erlangen, Germany

James Moyne, Univ. of Michigan
ITRS Aspects of Semiconductor Manufacturing

Markus Brummayer, Voestalpine,  Linz, Austria
Manufacturing Challenges in Other Industries, here the Steel Industy                             

Alain Astier, STMicroelectonics, Crolles, France
Manufacturing Challenges by More Moore

Thomas Kaufmann, Infineon Neubiberg, Germany
Manufacturing Challenges by Advanced Power Devices

Benedetto Vigna, STMicroelectronics, Italy
Manufacturing Challenges by More-than-Moore

Martin Schrems, ams Graz, Austria
Manufacturing Challenges by 3D devices

 

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